Erbium chromium laser

Brand Name : Biolase

Model Name / Code : Waterlase iplus

Manufacturer : Biolase

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EGP85,000.00

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Product Description

Soft Tissue
(Including Pulpal Tissues)*
Incision, excision, vaporization, ablation and
coagulation of oral soft-tissues, including:
• Excisional and incisional biopsies
• Exposure of unerupted teeth
• Fibroma removal
• Flap preparation – incision of soft tissue to prepare
a flap and expose the bone
• Flap preparation – incision of soft-tissue to prepare
a flap and expose unerupted teeth (hard and soft
tissue impactions)
• Frenectomy and frenotomy
• Gingival troughing for crown impressions
• Gingivectomy
• Gingivoplasty
• Gingival incision and excision
• Hemostasis
• Implant recovery
• Incision and drainage of abscesses
• Laser soft tissue curettage of the post-extraction
tooth sockets and the periapical area during
apical surgery
• Leukoplakia
• Operculectomy
• Oral papillectomies
• Pulpotomy
• Pulp extirpation
• Pulpotomy as an adjunct to root canal therapy
• Root canal debridement and cleaning
• Reduction of gingival hypertrophy
• Soft tissue crown lengthening
• Treatment of canker sores, herpetic and aphthous
ulcers of the oral mucosa
• Vestibuloplasty
Hard Tissues
General Indications*
• Class I, II, III, IV and V cavity preparation
• Caries removal
• Hard tissue surface roughening or etching
• Enameloplasty, excavation of pits and fissures for
placement of sealants Laser Periodontal Procedures
• REPAIR Protocol: Waterlase Er,Cr:YSGG assisted
new attachment procedure (cementum-mediated
periodontal ligament new attachment to the root
surface in the absence of long junctional epithelium)
• Removal of subgingival calculi in periodontal
pockets with periodontitis by closed or open
curettage
• Removal of highly inflamed edematous tissue
affected by bacteria penetration of the pocket lining
and junctional epithelium
• Full thickness flap
• Partial thickness flap
• Split thickness flap
• Laser soft tissue curettage
• Laser removal of diseased, infected, inflamed and
necrosed soft tissue within the periodontal pocket
• Removal of granulation tissue from bony defects
• Sulcular debridement (removal of diseased, infected,
inflamed or necrosed soft tissue in the periodontal
pocket to improve clinical indices including
gingival index, gingival bleeding index, probe depth,
attachment loss and tooth mobility)
• Osteoplasty and osseous recontouring (removal
of bone to correct osseous defects and create
physiologic osseous contours)
• Ostectomy (resection of bone to restore bony
architecture, resection of bone for grafting, etc.)
• Osseous crown lengthening
Root Canal Hard Tissue
• Tooth preparation to obtain access to root canal
• Root canal preparation including enlargement
• Root canal debridement and cleaning
• Laser root canal disinfection after endodontic
instrumentation Endodontic Surgery
(Amputation)
• Flap preparation – incision of soft-tissue to prepare
a flap and expose the bone
• Cutting bone to prepare a window access to the
apex (apices) of the root(s)
• Apicoectomy – amputation of the root end
• Root end preparation for retrofill amalgam or
composite
• Removal of pathological tissues (i.e.,cysts,
neoplasm or abscess) and hyperplastic tissues
(i.e., granulation tissue) from around the apex
Bone/Surgical
• Cutting, shaving, contouring and resection of oral
osseous tissues (bone)
• Osteotomy
Crowns & Veneers
• Removal of ceramic and porcelain crowns
and veneers

Item Name Erbium chromium laser
Brand Name Biolase
Model Name / Code Waterlase iplus
Manufacturer Biolase
Country of origin USA
Technical Specifications Dimensions 11 x 19 x 33 in (28 x 48 x 84cm) Weight 75 lbs. (34 kg) Operating Voltage 100 VAC +/- 10% / 230 VAC +/- 10% Frequency 50/60 Hz Current Rating 5A / 8A Main Control Circuit Breaker On/Off Control Keyswitch Water Type Distilled or De-ionized Only External Air Source 80 – 120 psi (5.5 – 8.2 bar)(4.1-8.2 bar) Interaction Zone 0.5 – 5.0 mm from Handpiece Tip to Target Laser Classification IV (4) Medium 2,780nm Frequency 5 – 100 Hz Average Power 0.1 – 10.0W Pulse Energy 0 – 600 mJ Pulse Duration for “H” Mode 60 µs Pulse Duration for “S” Mode 700 µs Tip Diameter 200 – 1200 µm
Package 1 Unit
Variations
Manufacture Date
Expiry Date
Guarantee terms 2 years
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